Call for Papers : International Conference on Materials Science and Engineering (November 12-13, 2021 in Vienna)
With the support of the prestigious Scopus indexed MDPI Journal of Materials (ISSN 1996-1944) and the International Journal of Engineering and Applied Physics (ISSN : 2737-8071), Scientex Conference solicits all the inspired participants to attend our grand Materials Science and Engineering Conference slated to be held from November 12-13, 2021 in Vienna, Austria under the theme “Shaping our future with materials”.
Material Science 2021 is a technical Conference encompassing keynote addresses, general oral presentation sessions, panel discussions, Networking sessions from specialists of Engineering, Materials Science, Electronics and Electricals, Biomaterials, Nanomaterials, Sensors, Electronics, Photonics, Physics, Chemistry, Polymers and other partnered arenas of Materials Science.
The main motto of the conference is to serve a platform to Academicians, Scientists, Researchers, businessmen, Industrial Professionals and students to exhibit all their research work and build a forum where sharing of thoughts and ideas to tackle the difficulties that our world throws infront us in the future from the point of emerging techniques and technologies in Science and engineering. Material Science 2021 emphasizes the soaring basic needs to energize innovative engineering solutions with maximum outreach capacity to the modern day problems. Thus, this would be a perfect setup for networking and strong basement for an eternal bond that lasts forever among the peers.
We invite you all on behalf of our beloved Organizing Committee, to this accomplished forum involving the duly participation of renowned researchers, scientists and other allied people from various countries all over the globe sharing their exciting, trending results pertaining to the Material Science World. All the conference proceedings will be published in the Scopus indexed MDPI Journal of Materials (ISSN 1996-1944) while the articles will be published in the International Journal of Engineering and Applied Physics (ISSN : 2737-8071).
- Abstract submission : October 15, 2021
- Registration Deadline : October 31, 2021
- Conference Date : November 12-13, 2021